Excellent high-temperature resistance: Ni201 is often used as the core material of high-temperature electronic components. The melting point of the Ni201 nickel plate can reach 1453℃. This temperature far exceeds the conventional operating temperature range of most high-temperature electronic components. In a long-term working environment of 300℃-1000℃, its mechanical properties, such as tensile strength and yield strength, will only show slight attenuation, and the attenuation amplitude is controlled within 10%. This performance is far better than that of ordinary metal materials. Even under extreme working conditions with sudden temperature changes, such as rapid temperature rise from room temperature to 800℃, and then back to room temperature, problems such as cracking and deformation will not occur. Structural integrity and dimensional stability can always be maintained, providing continuous and reliable support for circuit connections and signal transmission of electronic components, effectively avoiding risks such as shutdown and malfunction of electronic equipment due to substrate failure.
The working environment of high-temperature electronic components is often accompanied by corrosive media such as moisture, acid-base vapor, etc. Ni201 nickel plate shows excellent corrosion resistance due to its stable chemical properties. It has good corrosion resistance to sulfuric acid, hydrochloric acid, and sodium hydroxide. Moreover, it is not prone to oxidation and rust in humid environments, and can effectively avoid problems such as poor contact, circuit short circuit, and signal distortion in electronic components due to corrosion of the base material.
The stable operation of electronic components is inseparable from stable current transmission and timely heat dissipation. Its resistivity at 20℃ is only <=0.072Ω·mm²/m, which can ensure that the loss of current during transmission is minimized, reducing additional heat generated due to excessive resistance, and ensuring the efficient operation of electronic components. At the same time, its thermal conductivity is as high as 90W/(m·K), which can quickly conduct the heat generated by electronic components during operation to the heat dissipation structure, avoiding problems such as excessive temperature, performance degradation, or even burnout caused by heat accumulation inside the components.
High-temperature electronic components have various structures, which require extremely high processing accuracy and the forming capabilities of the base material. Ni201 nickel plate can perfectly meet various complex processing needs with its good plasticity and processing performance. It can perform cold processing and hot processing to achieve precise cutting, stamping, bending, welding, and other process operations. During the cutting process, the cuts are flat and smooth, and the dimensional error can be controlled within ±0.02mm; during stamping and forming, it can adapt to complex mold shapes, and the surface after forming has no wrinkles, cracks and other defects; during the welding process, the weld seam has high strength and is basically consistent with the performance of the base material, and there will be no welding embrittlement. Whether it is a small precision electronic connector or a large power module base material, Ni201 nickel plate can accurately match the molding needs of high-temperature electronic components of different specifications and structures, providing convenience for the large-scale production of electronic components.
| >=99.6% | |
| 0.2-10.0mm, customized | |
|
100-1500mm, customized |
|
| <=0.072Ω·mm²/m | |
|
±0.05mm |
|
| >=380MPa | |
| Cold-rolled bright/pickling | |
| 8.9g/cm³ |
Ni201 nickel plate has become the core substrate in the field of high-temperature electronic components due to its excellent high-temperature stability, electrical and thermal conductivity, and corrosion resistance. It is widely adapted to various electronic equipment scenarios that have strict working environment requirements.
, it is used to manufacture key components such as high-temperature-resistant connectors and signal transmission terminals. During the flight of aerospace equipment, electronic systems need to withstand extreme environments such as high altitude, low temperatures, high temperature fuselage friction, and sudden temperature changes. Ni201 nickel plates can ensure that connectors maintain stable connection performance and structural strength in the temperature range of -50℃ to 800℃, avoiding major risks such as communication interruptions and equipment failures due to base material failure, and providing a guarantee for the safe development of aerospace missions.
, high-temperature sensors are the core equipment for monitoring high-temperature production processes. The working environment is often accompanied by harsh conditions such as high temperatures and corrosion. The sensor housing and electrodes made of Ni201 nickel plate can resist high-temperature corrosion, ensuring that the sensor accurately collects data in high-temperature scenarios such as steel smelting and chemical reactions, providing a reliable basis for automated control of industrial production.
, Ni201 nickel plates also play an irreplaceable role in scenarios such as high-temperature electrodes in new energy equipment, high-power electronic components in communication base stations, traction electronic systems in rail transit, and high-temperature sterilization components in medical equipment. They can also be used in electronic packages and lead frames that require high-temperature stability, providing strong support for the upgrade and iteration of various high-end electronic equipment.
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